{"id":150668,"date":"2025-11-25T15:00:28","date_gmt":"2025-11-25T13:00:28","guid":{"rendered":"https:\/\/ldaily.ua\/?post_type=news&#038;p=150668"},"modified":"2025-11-23T16:36:10","modified_gmt":"2025-11-23T14:36:10","slug":"tsmc-zapustyt-vyrobnycztvo-chypiv-na-zavodi-v-nimechchyni-u-2027-roczi","status":"publish","type":"news","link":"https:\/\/ldaily.ua\/en\/news\/novosti\/tsmc-zapustyt-vyrobnycztvo-chypiv-na-zavodi-v-nimechchyni-u-2027-roczi\/","title":{"rendered":"TSMC to Launch Chip Production at Its German Plant in 2027"},"content":{"rendered":"<p data-start=\"96\" data-end=\"320\">The world\u2019s largest contract semiconductor manufacturer, TSMC, is making progress on the construction of its new European production complex: the factory in Dresden has officially moved to the main structural building phase.<\/p>\n<p data-start=\"322\" data-end=\"621\">After completing this stage, the company plans to begin installing key infrastructure systems \u2014 clean rooms, chemical supply lines, ultra-pure water facilities, and gas delivery systems. In the second half of 2026, production equipment is expected to start arriving on-site, followed by calibration.<\/p>\n<p data-start=\"623\" data-end=\"970\">The Dresden site of ESMC, a joint venture between TSMC, Bosch, Infineon, and NXP, will become the first factory in Europe capable of supporting 28\/22 nm and 16\/12 nm process technologies. Production is scheduled to begin in 2027. Once operating at full capacity, the plant will produce up to 40,000 300-mm wafers per month using FinFET technology.<\/p>\n<p data-start=\"972\" data-end=\"1510\">TSMC\u2019s European plans extend beyond the Dresden facility. In May, the company announced the creation of a chip design center in Munich, which will support the development of high-performance solutions for the automotive industry, artificial intelligence, and industrial IoT. The center is expected to become operational in the third quarter of 2025. In parallel, a research center has been opened at the Technical University of Munich to develop AI chips \u2014 part of a broader collaboration between TSMC and the German scientific community.<\/p>\n","protected":false},"featured_media":150669,"menu_order":0,"template":"","newscat":[9],"newstag":[],"issues":[],"class_list":["post-150668","news","type-news","status-publish","has-post-thumbnail","hentry","newscat-novosti"],"_links":{"self":[{"href":"https:\/\/ldaily.ua\/en\/wp-json\/wp\/v2\/news\/150668","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ldaily.ua\/en\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/ldaily.ua\/en\/wp-json\/wp\/v2\/types\/news"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ldaily.ua\/en\/wp-json\/wp\/v2\/media\/150669"}],"wp:attachment":[{"href":"https:\/\/ldaily.ua\/en\/wp-json\/wp\/v2\/media?parent=150668"}],"wp:term":[{"taxonomy":"newscat","embeddable":true,"href":"https:\/\/ldaily.ua\/en\/wp-json\/wp\/v2\/newscat?post=150668"},{"taxonomy":"newstag","embeddable":true,"href":"https:\/\/ldaily.ua\/en\/wp-json\/wp\/v2\/newstag?post=150668"},{"taxonomy":"issues","embeddable":true,"href":"https:\/\/ldaily.ua\/en\/wp-json\/wp\/v2\/issues?post=150668"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}